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Unity Opto Technology Co., Ltd.
Technical Data SideLEDs
MSL-518SB
PRELIMINARY
08/14/2003
Features
l l
Package : white micro-sideview PLCC-2 package with clear silicon. Feature of the device : extremely wide viewing angle ideal for backlighting and coupling in light guides
l l l l l l l l
Wavelength : Typical : 470nm Viewing angle : Lambertian Emitter (X : 120o / Y : 120o) Technology : InGaN on SiC with clear silicon Grouping parameter : luminous intensity , Chromaticity Assembly methods : suitable for all SMT assembly methods Soldering methods : IR reflow soldering Preconditioning : acc. to JEDEC Level 3 Taping : 8-mm tape with 3500/reel, 180mm
Applications
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Backlighting
: LCD Display, Key pads
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Package Dimensions
Unit : mm (inch)
Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is 0.1 unless other specified
Recommended Solder Patterns
1.6 1.6
1.1
2.1
Method of Taping / Polarity and Orientation Packing unit 3500/reel
4.240.1
1.020.1
1.540.1
Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is 0.1 unless other specified
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Selection Guide
Luminous Intensity Part Number Bin
MSL-518SB R S T U
Wavelength nm
Min.
75 104 150 213
mcd Typ.
-
Max.
104 150 213 300
Min.
460
Typ.
470
Max.
475
Viewing Angle 2 1/2 (Degrees) x y Typ. Typ.
120 120
Device Type Min.
MSL-518SB -
Forward Voltage VF (Volts) @IF = 20mA Typ.
3.1
Max
4.0
Reverse Current IR (uA) @ VR = 5V Min. Typ. Max
50
Thermal Resistance o R J-S ( C/W) Max
50
Maximum Ratings
Value Unit o -30 ~ +85 Operating Temp. range C o -40 ~ +100 Storage Temp. range C 30 mA Forward current mA 100 Peak forward current 5 V Reverse Voltage 120 mW Power dissipation Reflow Soldering : 260oC, for 10 sec Tsid Soldering Temperature Hand Soldering : 350oC, for 3 sec IFP Conditions : Pulse Width <10msec and Duty < 1/10 Symbol T OP T stg IF I FM VR P tot Parameter
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Relative Spectrum Emission Irel = f (l), TA = 25oC, IF = 20mA V(l) = Standard eye response curve
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Relative Luminous Intensity
0.5
0 380 450 520 590 660
Wavelength (nm) FIG.1 RELATIVE LUMINOUS INTERSITY VS. WAVELENGTH
Forward Current IF = f (VF) TA = 25 C
(mA) IF 30 25 20 15 10 5 0 0 1 2 3 VF 4 (V)
o
Relative Luminous Intensity IV/IV (20mA) = f (IF) TA = 25oC
2.0 1.8 IV 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 10 20 30 40 IF 50 (mA)
Forward Voltage (V) FIG.2 FORWARD CURRENT VS. FORWARD VOLTAGE
Forward Current IF (mA) FIG.3 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT
Ambient Temperature VS. Allowable Forward
(mA) IF 40
Radiation Characteristic Irel = f (q)
0o 10o 20o 30o
Y X
30 40o 20 1.0 0.9 10 TA temp. ambient 0 0 20 40 60 80 T 100 (oC) 0.7 0.5 0.3 0.1 0.2 0.4 0.6 0.8 50o 60o 70o 80o 90o
X Y
Ambient Temperature TA (oC) FIG.4 FORWARD CURRENT VS. AMBIENT TEMPERATURE
FIG.5 RADIATION DIAGRAM
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IR Reflow Soldering Profile Lead Solder Temp Pre heating 120-150oC 2-5oC / sec. 60sec. Max. Above 200oC 120sec. Max. 2-5oC / sec.
240oC Max. 10sec. Max.
Time
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Unity SideLEDs Bin Codes
Category Code T B
Luminous Intensity Group MSL-510SB R S T U 75-104 104-150 150-213 213-300
Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of +/- 11%
Dominant Wavelength (in nanometers) @ IF=20mA BIN B C A P/N minimum maximum minimum maximum minimum maximum SB 460 465 465 470 470 475 Wavelength groups are tested at a current pulse duration of 25 ms and an accuracy of 1nm
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Tape Dimensions
REEL Dimensions
Items Leader Cover Tape
Specifications Cover tape shall be longer than 400mm without carrier tape
Remarks The end of the carrier tape shall be adhered on the cover tape The orientation of tape shall be as shown The end of the tape shall be inserted into a slit of the hub
Carrier Tape There shall be more than 40 empties Trailer There shall be more than 40 empties
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Surface Mount Moisture Sensitivity Specifications
1. Controlling Moisture Unity Opto Technology, in its design of packing materials and packing methods, takes into consideration the susceptibility of some Unity packages to moisture induced damage. The risk of this damage is caused when the LED lens plastic encapsulation material is exposed to increases or decreases in the Relative Humidity of the surrounding environment. Such damage may include delamination between the die and the LED lens plastic encapsulation material, which may result in open connections due to broken wire bonds. Moisture in the package having reached a critical level will fracture the package in order to escape when exposed to peak temperature conditions, typical in soldering practices. Therefore, the control of moisture levels in the LED package is critical to reduce the risk of moisture-induced failures. Please follow JEDEC-STD-033A standards for handling moisture sensitive devices. 2. Packaging SMD devices: Unity packages all SMD devices into dry pack bags (moisture barrier bags). Unity includes a desiccant pouch in each bag. Testing confirms that the desiccant pouch greatly reduces the presence of moisture by maintaining the environment in the bag, thus protecting the devices during shipment and storage. 3. Handling Dry Packed Parts Upon receipt, the bags should be inspected for damage to ensure that the bag's integrity has been maintained. Inspection should verify that there are no holes, gouges, tears, or punctures of any kind that may expose the contents of the bag. To open the bag, simply cut across the top of the bag as close to the original seal as possible being careful not to damage the contents. Once open the desired quantity of units should be removed and the bag resealed. If the bag is left open longer than 2 hours, the desiccant pouch should be replaced with a dry desiccant and the bag should be sealed immediately to avoid moisture damage.
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